Kingspan Thermafloor TF73
Product Description
Kingspan Thermafloor TF73
Extruded polystyrene insulation bonded to T & G chipboard for floating & suspended ground floors
- High performance rigid extruded polystyrene insulation – thermal conductivity 0.029 W/m.K bonded to T & G chipboard
- No requirement for a vapour control layer
- Eliminates the need for wet screeds
- Excellent compressive strength
- Easy to handle and install
- Ideal for newbuild and refurbishment
- Non–deleterious material
- CFC/HCFC–free with zero Ozone Depletion Potential (ODP)
Technical Information
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