Knauf Thermal Laminate Plus
Product Description
CFC-free extruded polystyrene bonded to 9.5mm Knauf Wallboard. Low thermal conductivity means that thinner laminates can be used compared with expanded polystyrene laminates. This gives more internal room space as well as providing good vapour resistance.Knauf Thermal Laminate Plus has a Thermal Conductivity figure for wallboard of k = 0.16W/mK and for Extruded Polystyrene of 0.030W/mK.
Thermal Resistance:
27mm = 0.71m2 K/W
35mm = 1.00m2 K/W
40mm = 1.19m2 K/W
45mm = 1.37m2 K/W
55mm = 1.75m2 K/W
Technical Information
Product LiteratureSub Products
Sub Code
Length
Width
Thickness
Option